View 74LVC07A_17454.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
74LVC07A Hex buffer with open-drain outputs
Product specification File under Integrated Circuits, IC24 2000 Mar 07
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
FEATURES * 5 V tolerant inputs and outputs (open drain) for interfacing with 5 V logic * Wide supply voltage range from 1.65 to 5.5 V * CMOS low power consumption * Direct interface with TTL levels * Inputs accept voltages up to 5 V * Complies with JEDEC standard no. 8-1A. DESCRIPTION
74LVC07A
The 74LVC07A is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 to 5 V environment. The 74LVC07A provides six non-inverting buffers. The outputs of the 74LVC07A devices are open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 2.5 ns. SYMBOL tPLZ/tPZL CI CPD Note 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; (CL x VCC2 x fo) = sum of the outputs. FUNCTION TABLE See note 1. INPUT nA L H Note 1. H = HIGH voltage level; L = LOW voltage level; Z = high impedance OFF-state. OUTPUT nY L Z PARAMETER propagation delay nA to nY input capacitance power dissipation capacitance per gate VI = GND to VCC; note 1 CONDITIONS CL = 50 pF; VCC = 3.3 V TYP. 2.2 5.0 6.0 ns pF pF UNIT
2000 Mar 07
2
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
ORDERING INFORMATION PACKAGES TYPE NUMBER TEMPERATURE RANGE 74LVC07AD 74LVC07APW PINNING PIN 1, 3, 5, 9, 11 and 13 2, 4, 6, 8, 10 and 12 7 14 1A to 6A 1Y to 6Y GND VCC SYMBOL data inputs data outputs ground (0 V) DC supply voltage DESCRIPTION -40 to +85 C PINS 14 14 PACKAGE SO TSSOP
74LVC07A
MATERIAL plastic plastic
CODE SOT108-1 SOT402-1
handbook, halfpage
1
handbook, halfpage
1A
1Y 2
1A 1Y 2A 2Y 3A 3Y GND
1 2 3 4 5 6 7
MNA531
14 VCC 13 6A 12 6Y
3
2A
2Y 4
5
3A
3Y 6
07
11 5A 9 10 5Y 9 8 4A 4Y 13 6A 6Y 12 11 5A 5Y 10 4A 4Y 8
MNA535
Fig.1 Pin configuration.
Fig.2 Logic symbol.
2000 Mar 07
3
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
74LVC07A
handbook, halfpage
1A
1
1
2
1Y
2A
3
1
4
2Y
3A
5
1
6
3Y
handbook, halfpage
Y A
4A
9
1
8
4Y
MNA533
GND
5A
11
1
10
5Y
6A
13
1
MNA534
12
6Y
Fig.3 IEC logic symbol.
Fig.4 Logic diagram (one gate).
2000 Mar 07
4
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
RECOMMENDED OPERATING CONDITIONS LIMITS SYMBOL VCC VI VO Tamb tr, tf PARAMETER DC supply voltage DC input voltage DC output voltage operating ambient temperature input rise and fall ratios VCC = 1.65 to 2.7 V VCC = 2.7 to 5.5 V active mode high-impedance mode CONDITIONS MIN. 1.65 0 0 0 -40 0 0
74LVC07A
UNIT MAX. 5.5 5.5 VCC 5.5 +85 20 10 V V V V C ns/V ns/V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO IO ICC, IGND Tstg Ptot PARAMETER DC supply voltage DC input diode current DC input voltage DC output clamping diode current DC output voltage DC output sink current DC VCC or GND current storage temperature power dissipation per package SO package TSSOP package Note 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. above 70 C derate linearly with 8 mW/K above 60 C derate linearly with 5.5 mW/K - - 500 500 mW mW VI < 0 note 1 VO < 0 active mode; note 1 high-impedance mode; note 1 VO = 0 to VCC CONDITIONS - -0.5 - -0.5 -0.5 - - -65 MIN. -0.5 MAX. +6.5 -50 +6.5 -50 +6.5 50 100 +150 V mA V mA V mA mA C UNIT
VCC + 0.5 V
2000 Mar 07
5
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
DC CHARACTERISTICS Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH HIGH-level input voltage VCC (V) MIN. 1.7 2.0 0.7 x VCC - - - - - - - - - - - - - - Tamb (C) -40 to +85 TYP.(1) - - - - - - - - - - - - - - 0.1 0.1 0.1 0.1 5 - - - -
74LVC07A
UNIT MAX. V V V V V V V
1.65 to 1.95 VCC 2.3 to 2.7 2.7 to 3.6 4.5 to 5.5
VIL
LOW-level input voltage
1.65 to 1.95 - 2.3 to 2.7 2.7 to 3.6 4.5 to 5.5
GND 0.7 0.8
0.30 x VCC V 0.20 0.45 0.3 0.4 0.55 0.55 5 10 10 10 500 V V V V V V A A A A A
VOL
LOW-level output voltage VI = VIH or VIL IO = 100 A IO = 4 mA IO = 8 mA IO = 12 mA IO = 24 mA IO = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 4.5 3.6 3.6 0.0 5.5 2.3 to 5.5
II IOZ Ioff ICC ICC
input leakage current 3-state output OFF-state current power-off leakage current quiescent supply current additional quiescent supply current per input pin
VI = 5.5 V or GND VI = VIH or VIL; VO = 5.5 V or GND VI or VO = 6.5 V VI = VCC or GND; IO = 0 VI = VCC - 0.6 V; IO = 0
Note 1. All typical values are at VCC = 3.3 V and Tamb = 25 C.
2000 Mar 07
6
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
AC CHARACTERISTICS GND = 0 V; VCC 2.7 V and tr = tf 2 ns; VCC 2.7 V and tr = tf 2.5 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS tPLZ/tPZL propagation delay nA to nY see Figs 5 and 6 VCC (V) 1.65 to 1.95 2.3 to 2.7 2.7 3.0 to 3.6 4.5 to 5.5 Note - 0.5 0.5 0.5 0.5 MIN.
74LVC07A
Tamb (C) -40 to +85 TYP.(1) 2.5 1.6 2.4 2.2 1.6 MAX. - 2.8 3.3 3.6 2.6 ns ns ns ns ns UNIT
1. All typical values are measured at Tamb = 25 C and at VCC respectively 1.8, 2.5, 2.7, 3.3 and 5.0 V. AC WAVEFORMS
handbook, full pagewidth
VI nA input GND t PLZ VCC nY output VOL VX
MNA528
VM
t PZL
VM
VCC <2.7 V 2.7 to 3.6 V 4.5 to 5.5 V 1.5 V
VM 0.5 x VCC 0.5 x VCC
VX VOL + 0.15 V VOL + 0.3 V VOL + 0.3 V Fig.5 The input nA to output nY propagation delays.
2000 Mar 07
7
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
74LVC07A
handbook, full pagewidth
Vext VCC PULSE GENERATOR VI D.U.T. RT
MNA530
VO
RL
CL
RL
VCC 1.65 to 1.95 V 2.3 to 2.7 V 2.7 V 3.3 to 3.6 V 4.5 to 5.5 V
Vext 2 x VCC 2 x VCC 6V 6V 2 x VCC
VI VCC VCC 2.7 V 2.7 V VCC
CL 30 pF 30 pF 50 pF 50 pF 50 pF
RL 1 k 500 500 500 500
Fig.6 Load circuitry for switching times.
2000 Mar 07
8
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
PACKAGE OUTLINES SO14: plastic small outline package; 14 leads; body width 3.9 mm
74LVC07A
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
0.010 0.057 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2000 Mar 07
9
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
74LVC07A
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c y HE vMA
Z
14
8
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
7
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.72 0.38 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27
2000 Mar 07
10
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
74LVC07A
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2000 Mar 07
11
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
Suitability of surface mount IC packages for wave and reflow soldering methods
74LVC07A
SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
2000 Mar 07
12
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
NOTES
74LVC07A
2000 Mar 07
13
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
NOTES
74LVC07A
2000 Mar 07
14
Philips Semiconductors
Product specification
Hex buffer with open-drain outputs
NOTES
74LVC07A
2000 Mar 07
15
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245004/01/pp16
Date of release: 2000
Mar 07
Document order number:
9397 750 06737

▲Up To Search▲

Price & Availability of 74LVC07A

	To Download 74LVC07A Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .